韩美半导体有望拿下所有HBM4热压键合机订单，年应收将达1.1万亿韩元

爱集微08-04

韩美半导体（Hanmi Semiconductor）凭借其先进技术，对拿下第六代高带宽存储器HBM4热压键合机（TC bonder）的全部订单充满信心——该设备的需求预计将大幅增长。该公司还预计，今年的销售额较去年最多可增长一倍，达1.1万亿韩元。韩美半导体首席财务官（CFO）Kim Jung-young强调：“设备公司的业绩与客户的投资息息相关。我们预计HBM生产企业未来将重点投入HBM4的生产...

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