摩根士丹利：2026年全球CoWoS晶圆总需求达100万片，英伟达抢下60%产能

爱集微2025-07-30

摩根士丹利（大摩）最新研究报告预测，2026年全球CoWoS晶圆总需求将达100万片，其中，英伟达抢下60%产能。摩根士丹利对2026年台积电及其合作伙伴的CoWoS产能分配进行了详细预测，英伟达仍居主导地位，预计2026年CoWoS晶圆需求量将高达59.5万片，占全球市场约60％，其中约51万片将由台积代工，主要用于英伟达下一代Rubin架构AI芯片。据此推算，2026年英伟达芯片出货量可达...

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CPU及汽车芯片等产品线。此外近日有消息称，台积电在美国启动先进封装（AP）建厂计划浮上台面，首座先进封装预计明年动工并于2029年前完工。据悉，已有承包厂商开始招募CoWoS设备服务工程师，将派驻美国亚利桑那州。供应链透露，台积电美国先进封装会以SoIC（系统整合单芯片）、CoW（Chip on Wafer）为主，后段oS（on Substrate）预计将委由安靠进行。（校对/赵月）","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"dataReport","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":1,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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