PCB新技术方向：新材料、新架构、新封装“三新”共振，铸造板块强β

开源证券2025-07-29

（以下内容从开源证券《PCB新技术方向：新材料、新架构、新封装“三新”共振，铸造板块强β》研报附件原文摘录）新材料：M9级别覆铜板迭代在即，上游材料或发生“变革”英伟达Rubin代系产品、1.6T交换机等即将进入量产周期，其对介电损耗、膨胀系数等指标的要求进一步提升，在此基础上，覆铜板将升级至M9级别，配套应用的上游材料也将发生根本变化，需要满足高速低损耗等要求，向着低介电常数、低膨胀系数方向发展...

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