长电科技汽车电子取得半导体封装后端生产装置专利，减小后端工艺设备整体的占地面积

金融界2025-07-29

金融界2025年7月29日消息，国家知识产权局信息显示，长电科技汽车电子（上海）有限公司取得一项名为“半导体封装后端生产装置”的专利，授权公告号CN223167457U，申请日期为2024年09月。专利摘要显示，本实用新型涉及一种半导体封装后端生产装置。所述半导体封装后端生产装置包括：输送轨道，用于传输前端制品；上料机台，连接于所述输送轨道的端部，用于接收前端制品；多个后端工艺机台，沿所述输送轨道...

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