诺德股份：相较于标准电子电路铜箔（如HTE），HVLP的核心优势在于极低的表面粗糙度（Rz＜1.5μm），可显著降低高频信号传输损耗

互动易2025-07-30

有投资者向诺德股份提问， HVLP与传统铜箔的核心差异？公司回答表示，尊敬的投资者，您好！相较于标准电子电路铜箔（如HTE），HVLP的核心优势在于极低的表面粗糙度（Rz＜1.5μm），可显著降低高频信号传输损耗，适用于5g通信、AI服务器等超高速场景。感谢您的关注！

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