逸豪新材：公司正在进行高阶Micro LED PCB工艺研发

证券之星2025-07-25

证券之星消息，逸豪新材(301176)07月25日在投资者关系平台上答复投资者关心的问题。

投资者提问：《上海市下一代显示产业高质量发展行动方案（2026-2030 年）》的发布，行动方案明确提出 “补齐关键材料短板”，重点突破 Micro LED、硅基 OLED 等下一代显示技术的核心材料瓶颈。公司的核心产品 ——高频高速铜箔（如 HVLP 铜箔）和铝基覆铜板，恰好属于显示面板驱动电路、背板等关键组件的上游材料。公司将如何把握这一战略机遇？

逸豪新材回复：尊敬的投资者您好！公司正在进行高阶Micro LED PCB工艺研发，目前进展符合预期。感谢您的关注！

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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