苏州晶方半导体科技股份有限公司集成IPD结构的芯片测试封装方法及芯片封装结构专利公布（半导体封装专利快讯）

DoNews2025-07-25

天眼查App显示，2025年7月25日，“集成IPD结构的芯片测试封装方法及芯片封装结构”专利正式进入专利的公布阶段。申请人为苏州晶方半导体科技股份有限公司，该项半导体封装专利涉及芯片测试与封装技术领域。据专利信息显示，该方法通过在盖板晶圆表面制作IPD结构并实现晶圆级批量测试，显著优化芯片封装制造效率与性能调优成本。发明人为施秋楠、李俊杰、谢国梁、王蔚。本发明揭示了一种集成IPD结构的芯片测试...

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