迈为股份晶圆级混合键合设备实现批量交付

爱集微2025-07-20

近日，迈为股份自主研发的全自动晶圆级混合键合设备成功交付国内新客户，这是公司在半导体领域达成的又一重要合作。该设备凭借高精度、高稳定性及完全自主核心技术，已赢得市场多轮验证，为国产半导体装备自主可控注入新动能。此次交付的晶圆级混合键合设备，是迈为股份完全自主研发的成果，关键技术与核心部件均实现国产化，确保供应链安全与工艺独立性。设备可显著优化客户产线效率，降低制造成本，助力提升市场竞争力。作为...

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