沈阳芯源微电子设备股份有限公司真空式助焊剂清洗装置及清洗方法专利公布（半导体制造设备专利快讯）

DoNews2025-07-16

天眼查App显示，2025年7月15日，“真空式助焊剂清洗装置及清洗方法”正式进入专利的公布阶段。申请人为沈阳芯源微电子设备股份有限公司，该项基本电气元件领域的专利涉及半导体制造后段工艺中晶圆级助焊剂残留清洗场景。据专利信息显示，通过抽真空破坏清洗液表面张力并利用气压差驱动清洗液完全浸入芯片与晶圆间隙的技术方案，有效消除微小间隙内的“气穴”现象，使清洗液充分接触并溶解助焊剂，避免产生工艺缺陷，实现...

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