迈为股份自研全自动晶圆级混合键合设备交付新客户

LEDinside2025-07-16

7月15日，迈为股份宣布，公司自主研发的全自动晶圆级混合键合设备成功交付国内新客户。图片来源：迈为股份据悉，迈为股份的全自动晶圆级混合键合设备具有模块化设计便于安装与调试、拥有高精度主动找平机构、内环境达class1等级等特点。设备关键部件包括气浮块、柔性铰链微动/宏动运动台等均由迈为股份自主研制。迈为股份表示，本次交付的设备将助力客户构建高效、先进的半导体产线，显著优化产品制造成本，提升市场...

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