绍兴比亚迪半导体取得一种晶圆结构专利，避免酸液对芯片造成腐蚀

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金融界2025年7月12日消息，国家知识产权局信息显示，绍兴比亚迪半导体有限公司取得一项名为“一种晶圆结构”的专利，授权公告号CN223092863U，申请日期为2024年02月。专利摘要显示，本申请实施例提供了一种晶圆结构晶圆结构包括基底层，所述基底层上设置有至少一个切割道，以将所述基底层分隔出芯片区；所述切割道内设置有阻挡部，所述阻挡部填充至少部分所述切割道。这样，在后续采用酸液进行清洁处理的...

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2550991752?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2025-07-12 15:11","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2550991752","market":"hk","top_or_hot":-1,"title":"绍兴比亚迪半导体取得一种晶圆结构专利，避免酸液对芯片造成腐蚀","media":"金融界","content":"<div>\n<p>金融界2025年7月12日消息，国家知识产权局信息显示，绍兴比亚迪半导体有限公司取得一项名为“一种晶圆结构”的专利，授权公告号CN223092863U，申请日期为2024年02月。专利摘要显示，本申请实施例提供了一种晶圆结构晶圆结构包括基底层，所述基底层上设置有至少一个切割道，以将所述基底层分隔出芯片区；所述切割道内设置有阻挡部，所述阻挡部填充至少部分所述切割道。这样，在后续采用酸液进行清洁处理的...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025071215223897a33e6f&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>绍兴比亚迪半导体取得一种晶圆结构专利，避免酸液对芯片造成腐蚀</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n绍兴比亚迪半导体取得一种晶圆结构专利，避免酸液对芯片造成腐蚀\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-07-12 15:11 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025071215223897a33e6f&s=b><strong>金融界</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>金融界2025年7月12日消息，国家知识产权局信息显示，绍兴比亚迪半导体有限公司取得一项名为“一种晶圆结构”的专利，授权公告号CN223092863U，申请日期为2024年02月。专利摘要显示，本申请实施例提供了一种晶圆结构晶圆结构包括基底层，所述基底层上设置有至少一个切割道，以将所述基底层分隔出芯片区；所述切割道内设置有阻挡部，所述阻挡部填充至少部分所述切割道。这样，在后续采用酸液进行清洁处理的...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025071215223897a33e6f&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0871576103.HKD","symbol_name":"HSBC GIF CHINESE EQUITY \"AC\" (HKD) ACC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025071215223897a33e6f&s=b","article_id":"2550991752","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025071215223897a33e6f&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2550991752","pubTimestamp":1752304315,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"金融界2025年7月12日消息，国家知识产权局信息显示，绍兴比亚迪半导体有限公司取得一项名为“一种晶圆结构”的专利，授权公告号CN223092863U，申请日期为2024年02月。天眼查资料显示，绍兴比亚迪半导体有限公司，成立于2022年，位于绍兴市，是一家以从事计算机、通信和其他电子设备制造业为主的企业。通过天眼查大数据分析，绍兴比亚迪半导体有限公司参与招投标项目12次，专利信息14条，此外企业还拥有行政许可23个。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"81211":"比亚迪股份-R","LU0871576103.HKD":"HSBC GIF CHINESE EQUITY \"AC\" (HKD) ACC","LU0865486749.SGD":"Eastspring Investments - Asian Equity Income AS SGD-H","LU0084288322.USD":"Natixis Asia Equity RD USD","LU1770034418.SGD":"ALL CHINA EQUITY \"A\" (SGDHDG) ACC","BK1522":"燃料电池","LU0708995583.HKD":"TEMPLETON CHINA \"A\" (HKD) ACC","LU2097828714.EUR":"AZ EQUITY CHINA \"BAZ\" (EUR) ACC","LU0165289439.USD":"HSBC GIF ASIA EX JAPAN EQUITY \"AC\" ACC","LU2097828557.USD":"AZ EQUITY CHINA \"A\" (USD) ACC","LU0511384066.AUD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (AUDHDG) ACC","LU1242518857.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"I\" (USD) ACC","LU2476274720.SGD":"ALLIANZ CHINA FUTURE TECHNOLOGIES \"AT\" (SGDHDG) ACC","LU0315178854.USD":"EASTSPRING INVESTMENTS ASIAN EQUITY INCOME \"A\" ACC","00285":"比亚迪电子","IE00BD6J9T35.USD":"NEUBERGER BERMAN NEXT GENERATION MOBILITY \"A\" (USD) ACC","LU0516422952.EUR":"FULLERTON LUX FUNDS - ASIA FOCUS EQUITIES \"I\" (EUR) ACC","LU0348767384.USD":"ALLIANZLITTLE DRAGONS \"A\" (USD) ACC","LU0509642566.USD":"SCHRODER ISF GLOBAL EMERGING MARKET OPPORTUNITIES \"A\" (USD) INC AV","LU0259732245.USD":"EASTSPRING INVESTMENTS DRAGON PEACOCK A","LU0543330566.HKD":"TEMPLETON BRIC \"A\" (HKD) ACC","01211":"比亚迪股份","LU0531970944.HKD":"HSBC GIF BRIC EQUITY \"AC\" (HKD) ACC","LU0307460666.USD":"EASTSPRING INVESTMENTS CHINA EQUITY \"A\" ACC","LU0823426480.USD":"法巴中国股票经典Dis","SG9999015945.SGD":"LionGlobal Disruptive Innovation Fund A SGD","BK1540":"电池","LU0823426308.USD":"法巴中国股票基金","LU1868838027.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"8\" (USD) ACC","BYDDY":"比亚迪ADR","LU0856984785.SGD":"HSBC GIF MANAGED SOLUTIONS ASIA FOCUSED GROWTH \"ACH\" (SGDHDG) ACC","SG9999015986.USD":"LIONGLOBAL DISRUPTIVE INNOVATION \"I\" (USD) ACC","LU0244354667.USD":"SCHRODER ISF CHINA OPPORTUNITIES \"A\" ACC","LU2360107325.USD":"BGF FUTURE OF TRANSPORT \"A4\" (USD) INC","LU1251922891.USD":"NINETY ONE GSF ALL CHINA EQUITY \"A\" (USD) ACC","LU1861214812.USD":"Blackrock Future of Transport A2 USD","LU0274383008.USD":"MANULIFE GF ASIAN SMALL CAP EQUITY \"AA\" (USD) INC","LU1861219969.SGD":"Blackrock Future of Transport A2 SGD-H","LU1880383440.USD":"AMUNDI FUNDS CHINA EQUITY \"A2\" (USD) INC","HYDD.SI":"BYD HK SDR 10to1","LU0449509016.USD":"HSBC GIF BRIC EQUITY \"AC\" (USD) ACC","LU1720050803.USD":"安联全方位中国股票基金","BK1149":"通信设备","LU1808992512.USD":"AB ALL CHINA EQUITY PORTFOLIO \"A\" (USD) ACC","LU0326950275.SGD":"Schroder ISF China Opportunities A Acc SGD-H","LU0594300179.USD":"FIDELITY CHINA CONSUMER \"A\" (USD) ACC","002594":"比亚迪","BK1607":"新IT概念","LU2357125470.USD":"BNP PARIBAS ENERGY TRANSITION \"CLASSIC RH\" (USDHDG) ACC","LU0588545490.SGD":"Eastspring Investments - Asian Equity Income AS SGD"},"translate_title":"Shaoxing BYD Semiconductor obtains a wafer structure patent to prevent acid from corroding the chip","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"81211":0.6,"002594":0.6,"00285":1,"01211":1,"BYDDY":0.6,"HYDD.SI":0.6},"content_text":"金融界2025年7月12日消息，国家知识产权局信息显示，绍兴比亚迪半导体有限公司取得一项名为“一种晶圆结构”的专利，授权公告号CN223092863U，申请日期为2024年02月。专利摘要显示，本申请实施例提供了一种晶圆结构晶圆结构包括基底层，所述基底层上设置有至少一个切割道，以将所述基底层分隔出芯片区；所述切割道内设置有阻挡部，所述阻挡部填充至少部分所述切割道。这样，在后续采用酸液进行清洁处理的工艺中，可以采用粘附性较弱的保护膜，例如蓝膜，对晶圆结构的基底层进行包覆，由于阻挡部至少部分填充于切割道，对切割道具有阻挡作用，能够防止酸液从切割道渗入并沿交汇处四散传输至芯片区，避免了酸液对芯片造成腐蚀的问题，改善产品的钻酸情况。无需采用粘附性较强UV膜，避免撕去UV膜时容易粘连在贴膜工具上造成破片，提高了产品的良品率。也无需在较短时间内撕去保护膜，降低工艺要求，减少了生产成本。天眼查资料显示，绍兴比亚迪半导体有限公司，成立于2022年，位于绍兴市，是一家以从事计算机、通信和其他电子设备制造业为主的企业。企业注册资本5000万人民币。通过天眼查大数据分析，绍兴比亚迪半导体有限公司参与招投标项目12次，专利信息14条，此外企业还拥有行政许可23个。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"deviceId":"web-server-community-laohu8-v3","version":"4.35.12","shortVersion":"4.35.12","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2550991752","isCrawlerRequest":true}