苏州国际科技园闪耀集微大会，展现千亿级“硬核科技”实力

市场资讯2025-07-11

炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 7月3日，第九届集微半导体大会在上海张江科学会堂隆重开幕。这场为期3天的行业盛会以全新的视野开启了中国半导体产业交流的新篇章，汇聚全球智慧，共谋产业未来。作为长三角集成电路产业重要载体，SISPARK（苏州国际科技园）亮相集微半导体展，展现其在人工智能、EDA工具等领域的的深厚技术积累与创新实力，以创新成果为全球半导体格局...

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