英伟达认证推迟，但三星HBM3E有了新进展

电子发烧友2025-07-12

电子发烧友网综合报道，据韩媒报道，三星电子近期已完成与博通就12层HBM3E产品的质量测试，正就量产供应展开磋商。当前协商的供应量按容量计算约为10亿Gb级别左右，量产时间预计最早从今年下半年延续至明年。目前博通凭借自有半导体设计能力，正为谷歌代工第七代TPU"Ironwood"及Meta自研AI芯片"MTIA v3"。此外，三星电子也积极推进向亚马逊云服务（AWS）供应HBM3E 12层产品，...

网页链接

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

精彩评论

我们需要你的真知灼见来填补这片空白

发表看法

{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2550896395?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2025-07-12 00:16","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2550896395","market":"us","top_or_hot":-1,"title":"英伟达认证推迟，但三星HBM3E有了新进展","media":"电子发烧友","content":"<div>\n<p>电子发烧友网综合报道，据韩媒报道，三星电子近期已完成与博通就12层HBM3E产品的质量测试，正就量产供应展开磋商。当前协商的供应量按容量计算约为10亿Gb级别左右，量产时间预计最早从今年下半年延续至明年。目前博通凭借自有半导体设计能力，正为谷歌代工第七代TPU\"Ironwood\"及Meta自研AI芯片\"MTIA v3\"。此外，三星电子也积极推进向亚马逊云服务（AWS）供应HBM3E 12层产品，...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025071201332097a29460&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>英伟达认证推迟，但三星HBM3E有了新进展</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n英伟达认证推迟，但三星HBM3E有了新进展\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-07-12 00:16 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025071201332097a29460&s=b><strong>电子发烧友</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>电子发烧友网综合报道，据韩媒报道，三星电子近期已完成与博通就12层HBM3E产品的质量测试，正就量产供应展开磋商。当前协商的供应量按容量计算约为10亿Gb级别左右，量产时间预计最早从今年下半年延续至明年。目前博通凭借自有半导体设计能力，正为谷歌代工第七代TPU\"Ironwood\"及Meta自研AI芯片\"MTIA v3\"。此外，三星电子也积极推进向亚马逊云服务（AWS）供应HBM3E 12层产品，...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025071201332097a29460&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"3NVD.UK","symbol_name":"LS 3X NVIDIA","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025071201332097a29460&s=b","article_id":"2550896395","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025071201332097a29460&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2550896395","pubTimestamp":1752250560,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"电子发烧友网综合报道，据韩媒报道，三星电子近期已完成与博通就12层HBM3E产品的质量测试，正就量产供应展开磋商。但韩媒报道，三星电子已于第二季度末减少了12层HBM3E的产量。三星电子今年第二季度HBM3E 12层硅片的产量预计平均每月7万至8万片。最近，三星开始向AMD供应其 12 层HBM3E。现阶段，三星一方面与英伟达就12层HBM3E的认证还需要时间，另一方面全球科技巨头的ASIC自研芯片为三星提供了HBM3E出货的新途径。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"3NVD.UK":"LS 3X NVIDIA","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","LU0225283273.USD":"SCHRODER ISF GLOBAL EQUITY ALPHA \"A\" (USD) ACC","LU0353189763.USD":"ALLSPRING  US ALL CAP GROWTH FUND \"I\" (USD) ACC","NVDD":"1倍做空NVDA ETF-Direxion","LU2168563687.JPY":"AZ ALLOCATION - TREND \"AAZ\" (JPYHDG) ACC","NVD2.UK":"2X NVIDIA ETP","LU1633808545.USD":"ALLIANZ GLOBAL EQUITY GROWTH \"AT\" (USD) ACC","LU2750360997.AUD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (AUDHDG) INC","NVDA":"英伟达","LU0203202063.USD":"AB SICAV I - ALL MARKET INCOME PORTFOLIO \"A2X\" (USD) ACC","LU2602419157.SGD":"HSBC ISLAMIC GLOBAL EQUITY INDEX \"AC\" (SGD) ACC","LU0444973449.USD":"CT (LUX) I GLOBAL TECHNOLOGY \"DU\" (USD) ACC","LU0077335932.USD":"FIDELITY AMERICAN GROWTH \"A\" INC","IE00BWXC8680.SGD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A5\" (SGD) ACC","LU0310800379.SGD":"FTIF - Templeton Global A Acc SGD","LU1934455277.USD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"AD\" (USD) INC","IE00BJLML261.HKD":"HSBC GLOBAL EQUITY INDEX \"HCH\" (HKD) ACC","LU2420271590.USD":"ALLIANZ SELECT INCOME AND GROWTH \"AT\" (USD) ACC","NVIW.SI":"NVDA 3xLongSG261006","NVDS":"1.5倍做空NVDA ETF-Tradr","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","LU1861215975.USD":"贝莱德新一代科技基金 A2","LU1674673428.USD":"HSBC GIF GLOBAL LOWER CARBON EQUITY \"AC\" (USD) ACC","BK4527":"明星科技股","LU0444971666.USD":"天利全球科技基金","SNVD.UK":"LS -1X NVIDIA","NVDU":"2倍做多NVDA ETF-Direxion","LU1839511570.USD":"WELLS FARGO GLOBAL FACTOR ENHANCED EQUITY \"I\" (USD) ACC","SG9999002224.SGD":"Allianz Global High Payout SGD","NVDS.UK":"LS -1X NVIDIA","LU1435385759.SGD":"Natixis Loomis Sayles US Growth Equity RA SGD-H","LU0708994859.HKD":"TEMPLETON GLOBAL \"A\" (HKD) ACC","BK4585":"ETF&股票定投概念","LU2242649171.HKD":"FIDELITY FUNDS GLOBAL THEMATIC OPPORTUNITIES \"A\" (HKD) ACC","SSNLF":"三星电子","LU0154236417.USD":"BGF US FLEXIBLE EQUITY \"A2\" ACC","LU2294711713.HKD":"BNP PARIBAS ENERGY TRANSITION \"C\" (HKD) ACC","NVDX":"2倍做多NVDA ETF-T-Rex","LU1868836757.USD":"CT (LUX) I AMERICAN FUND \"2\" (USD) ACC","NVD3.UK":"LS 3X NVIDIA","2NVD.UK":"2X NVIDIA ETP","NVD":"2倍做空NVDA ETF-GraniteShares","LU0080751232.USD":"富达环球多元动力基金A","LU0965509101.SGD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (SGDHDG) ACC","NVDY":"NVDA期权收益策略ETF-YieldMax","LU1935043023.USD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME \"AA\" (USD) INC A","LU0107464264.USD":"abrdn SICAV I - GLOBAL INNOVATION EQUITY \"A\" (USD) ACC","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU1935042215.USD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME  \"AA\" (USD) INC A"},"translate_title":"Nvidia certification delayed, but Samsung HBM3E has new developments","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"SNVD.UK":0.6,"NVDX":0.6,"NVD2.UK":0.6,"NVDY":0.6,"NVD":0.6,"NVDS.UK":0.6,"3NVD.UK":0.6,"NVDA":1,"NVIW.SI":0.6,"NVDD":0.6,"2NVD.UK":0.6,"SSNLF":0.9,"NVDU":0.6,"NVDS":0.6,"NVD3.UK":0.6},"content_text":"电子发烧友网综合报道，据韩媒报道，三星电子近期已完成与博通就12层HBM3E产品的质量测试，正就量产供应展开磋商。当前协商的供应量按容量计算约为10亿Gb级别左右，量产时间预计最早从今年下半年延续至明年。目前博通凭借自有半导体设计能力，正为谷歌代工第七代TPU\"Ironwood\"及Meta自研AI芯片\"MTIA v3\"。此外，三星电子也积极推进向亚马逊云服务（AWS）供应HBM3E 12层产品，近期已在平泽园区启动实地审核。AWS计划明年量产搭载该存储器的下一代AI芯片\"Trainium 3\"。7月8日，三星电子在韩国公布2025年第二季度运营利润为4.60万亿韩元，低于分析师预期的6.18万亿韩元；销售额为74.00万亿韩元，也低于预期的75.77万亿韩元，主要因美国制度和库存问题导致非记忆芯片业绩下滑。三星电子已在位于平泽的P1和P3生产线上量产HBM3E 12层。三星此前设定目标，计划将今年HBM总供应量扩大至上年两倍的80-90亿Gb水平。但韩媒报道，三星电子已于第二季度末减少了12层HBM3E的产量。三星电子今年第二季度HBM3E 12层硅片的产量预计平均每月7万至8万片。 然而，三星电子在第二季度末大幅减少了晶圆投入，目前的产量为每月3万至4万片。原因是原本计划在今年年中向英伟达供应该产品，但随着谈判的拖延，下半年需求的不确定性加剧。三星电子最初的目标是在6月份完成测试，但测试或将最迟在9月份完成。业内人士表示，发热问题仍在讨论中。市场研究机构伯恩斯坦分析预计，到2025年SK海力士仍将以57%的占有率保持领先，但三星(27%)和美光(16%)的追赶将使市场格局更趋均衡。最近，三星开始向AMD供应其 12 层HBM3E。该公司还与多家客户合作开发定制的 HBM4 产品，预计该产品将从明年开始为公司带来收入。其他厂商方面，SK海力士展示HBM4技术，其容量可达48GB，带宽高达2.0TB/s，I/O速度为8.0Gbps，SK海力士表示计划在2025年下半年进行量产。SK海力士还拥有全球首例16层HBM3E技术，带宽为1.2TB/s。另外，美光科技已将12层堆叠36GB HBM4送样给多家主要客户，是继SK海力士后第二家宣布出货HBM4的业者。美光HBM4预计将于2026年量产，以配合客户下一代AI平台的扩产进度。三星芯片业务负责人全永铉在3月股东大会上承认，HBM市场的早期失利导致落后于SK海力士，并承诺在HBM4领域绝不再重蹈覆辙，这款下一代内存将应用于英伟达的RubinGPU架构。现阶段，三星一方面与英伟达就12层HBM3E的认证还需要时间，另一方面全球科技巨头的ASIC自研芯片为三星提供了HBM3E出货的新途径。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.43.1","shortVersion":"4.43.1","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2550896395","isCrawlerRequest":true}