元件行业深度报告：特种玻纤布供不应求，国产厂商加速渗透

开源证券2025-07-10

（以下内容从开源证券《元件行业深度报告：特种玻纤布供不应求，国产厂商加速渗透》研报附件原文摘录）AI发展催化PCB和CCL迭代，特种玻纤布快速升级且供不应求AI服务器和高频高速通信网络系统的快速发展推动对大尺寸、高多层PCB和高频高速覆铜板的需求升级，PCB及CCL迭代速度也逐渐加快，PCB产品层数增加，高阶HDI应用占比提升，CCL材料向着低介电常数、低膨胀系数方向发展。Low-Dk、Low ...

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