帝尔激光：公司实现晶圆级和面板级TGV封装激光技术全面覆盖

证券之星2025-07-11

证券之星消息，帝尔激光(300776)07月11日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘你好，贵司的半导体产业链目前订单如何，贵司接下去尽量往半导体布局，形成双主业，免得被光伏产业拖累。

帝尔激光回复：您好，感谢您的关注！公司持续聚焦主营业务的同时积极向消费电子、新型显示和集成电路等领域开拓。公司应用于半导体芯片封装、显示芯片封装等领域的TGV设备，已经完成面板级玻璃基板通孔设备的出货，实现了晶圆级和面板级TGV封装激光技术的全面覆盖。谢谢您的建议！

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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