飞凯材料：公司半导体材料主要应用于IC前道制造与中后道封装

互动易2025-07-09

有投资者向飞凯材料提问，董秘你好，公司产品能应用在光刻机领域吗？公司回答表示，您好，公司半导体材料主要应用于IC前道制造与中后道封装。

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