消息称联电先进封装中介层获得高通验证，接近量产出货

IT之家2025-07-08

IT之家 7 月 8 日消息，台媒《经济日报》昨日报道称，联华电子（IT之家注：即联电、UMC）的先进封装中介层 (Interposer) 获得高通验证，进入试产阶段，有望 2026 年首季度量产出货。▲ 联电官网对中介层介绍报道指出，联电的先进封装中介层业务此前局限在 RFSOI 制程应用领域，对营收贡献有限；而与高通的合作则将业务扩展到高速计算芯片方面，包括 AI PC、车载芯片和 AI ...

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