2026年日本半导体设备销售额将增长10.0%突破5万亿日元

爱集微2025-07-05

日本半导体制造装置协会（SEAJ）公布的最新的报告显示，因AI服务器用GPU、HBM需求旺盛，中国台湾先进晶圆代工厂（台积电）将开始量产2nm，对2nm的投资增加，加上韩国对DRAM/HBM的投资增加，预计2025年度（2025年4月-2026年3月）日本制造的半导体设备销售额自前次（2025年1月）预估的46,590亿日元上修至48,634亿日元，将较2024年度增加2.0%，年销售额将连续...

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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250705230916979b189a&s=b><strong>爱集微</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>日本半导体制造装置协会（SEAJ）公布的最新的报告显示，因AI服务器用GPU、HBM需求旺盛，中国台湾先进晶圆代工厂（台积电）将开始量产2nm，对2nm的投资增加，加上韩国对DRAM/HBM的投资增加，预计2025年度（2025年4月-2026年3月）日本制造的半导体设备销售额自前次（2025年1月）预估的46,590亿日元上修至48,634亿日元，将较2024年度增加2.0%，年销售额将连续...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250705230916979b189a&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2357125470.USD","symbol_name":"BNP PARIBAS ENERGY TRANSITION \"CLASSIC RH\" (USDHDG) 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Flash(300层以上产品)的投资预计增长，因此将2026年度日本芯片设备销售额自前次预估的51,249亿日元上修至53,498亿日元、将年增10.0%，年销售额将史上首度冲破5万亿日元大关、续创历史新高。此外，SEAJ 统计的数据指出，2025年5月份日本制芯片设备销售额为4,462.91亿日元、较去年同月增加11.3%，连续第17个月呈现增长，增幅连14个月达两位数(10%以上)水准，月销售额连续第19个月突破3,000亿日元、连7个月高于4,000亿日元，仅略低于2025年4月的4,470.38亿日元，创1986年开始进行统计以来历史次高纪录。 2025年1-5月期间，日本芯片设备销售额达21,545.84亿日元、较去年同期暴增20.5%，就历年同期来看，远超2024年的17,880.33亿日元、创下历史新高纪录。数据显示，2025-2027年度期间日本芯片设备销售额的年均复合成长率（CAGR）预估为4.9%。日本芯片设备全球市占率（以销售额换算）达30%，仅次于美国。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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