半导体巨头恩智浦，将与国产晶圆厂打造完全本地化产品

汽车半导体情报局2025-07-08

关注公众号，点击公众号主页右上角“ · · · ”，设置星标，实时关注汽车半导体最新资讯7 月 7 日消息，荷兰半导体巨头恩智浦于上周举办 2025 汽车领导力媒体开放日，全方位展示了其在汽车领域的实力及创新成果，推出了多款电气化系统领域的最新产品，同时与多家中国车企宣布达成深度合作。恩智浦半导体执行副总裁兼中国事业部总经理李晓鹤进行了主旨发言，强调了恩智浦与中国市场的紧密联系。恩智浦在华发展近 ...

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多名工程师，为中国和全球客户定义、设计和开发了 200 种产品，并且在天津运营一座恩智浦全球最大的封装与测试工厂。今年 1 月，恩智浦正式成立了中国事业部，还在加码建设中国供应链。恩智浦大中华区汽车电子市场总监周翔透露，公司正在中国选一家晶圆厂作为合作伙伴，计划将公司产品从前道到后道、从晶圆到封装测试，“全部在中国市场打造出来”。从开放日获悉，恩智浦半导体与吉利汽车研究院成立联合创新实验室，深化双方合作，聚焦智能化汽车技术，携手创新，助力吉利汽车智能化战略加速落地。恩智浦半导体与深蓝汽车科技有限公司续签联合创新中心合作协议。双方将围绕新能源汽车电子电气架构、整车动力控制、无线通信等关键领域，深化产品设计与前沿应用研发合作，推动智能电动汽车技术加速发展。恩智浦半导体宣布与长城汽车股份有限公司深化合作，围绕电气化、下一代电子电气架构携手深耕，共促长城汽车智能化进阶。恩智浦半导体宣布，零跑全新的 LEAP 3.5 中央集成电子电气架构中采用恩智浦 S32K388，助力其实现中央域控集成进一步升级。同时，随着基于该架构的零跑 B 系列首款全球化车型 B10 的发布，也实现了恩智浦 S32K388 的全球量产首发。来源：IT之家-End->>>>公众号推荐>>>>分布图领取>>>>加入社群往期回顾寻找车规级功率半导体企业PDF分享 | IGBT详解PDF分享| 芯片封装PDF分享| IGBT基本特性PDF分享| 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