智立方：公司在光通信CPO半导体领域推出了多款设备

讯石光通讯网07-02

ICC讯日前智立方在互动平台表示，公司在光通信CPO半导体领域推出了多款设备，包括光芯片排巴机、摆盘机、光芯片AOI设备、高精度固晶机等，设备已进入行业技术路线领先的硅光领域，逐步扩大市场份额。此外还有投资者提问，量子计算、6G等新兴技术对半导体设备的未来发展有哪些潜在影响？公司如何应对？智立方回答表示，量子计算、6G等新兴技术将对半导体设备提出更高精度、效率和可靠性的要求，带来市场机遇，...

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