挑战6纳米，联电正探索与英特尔进一步扩大合作可能性

全球半导体观察2025-07-02

晶圆代工大厂联电（UMC）正积极评估进军6纳米制程，借此拓展高端芯片市场，寻求新的成长动能。消息人士指出，联电正探索与英特尔进一步扩大合作的可能性，计划从现有的12纳米合作基础，延伸至6纳米，未来双方也不排除在亚利桑那州展开更深层次的建厂合作。6 纳米属于先进制程，主要应用于AI加速器、无线通讯及车用芯片等领域，制程与前代有明显差异。 7纳米是EUV光刻导入前的最后一代，普遍采用DUV多重曝光...

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