飞凯材料：产品包括应用于半导体制造及先进封装领域的锡球等

互动易2025-07-03

有投资者向飞凯材料提问，董秘你好，看到新闻介绍飞凯材料与盛合晶微的合作主要在半导体材料供应方面，飞凯材料作为国内领先的先进封装材料公司提供临时键合材料、bumping厚胶等产品。这些材料应用于先进封装技术，如2.5D CoWoS封装、info POP封装以及wafer - to - wafer hybrid bonding工艺等，是否属实谢谢。公司回答表示，您好，公司半导体材料领域客户主要为大型...

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