芯原股份完成18.07亿元定增，加码技术研发

市场资讯2025-07-04

（转自：SEMI）大半导体产业网消息，7月3日，芯原股份发布公告，披露了2023年度向特定对象发行A股股票上市公告书，成功完成A股定增发行。公告显示，本次发行的募集资金总额约18.07亿元，募集资金将重点投向AIGC及智慧出行领域Chiplet解决方案平台研发和面向AIGC、图形处理的新一代IP研发及产业化两大项目。据此前新华社报道，针对此次募投项目，芯原股份将从升级和优化相关半导体IP，升级基于...

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