台积电为苹果打造2纳米专线，英伟达/微美全息搭建AI芯片开源生态开启算力竞赛新篇

中国产业经济信...2025-07-01

据消息，苹果（AAPL.US）公司计划在 2026 年推出的 iPhone 18 系列中采用台积电(TSM.US)的下一代 2 纳米制程工艺，并结合先进的 WMCM封装方法。台积电为苹果建2纳米专用产线WMCM 封装技术则在多芯片集成方面表现出色，能够将 CPU、GPU、DRAM 以及其他定制加速器（如 AI / ML 芯片）等复杂系统紧密集成在一个封装内，可提供更大的灵活性，可以在封装内垂直堆叠...

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纳米芯片，苹果有望成为首家获得基于该新工艺芯片的公司。AI算力竞赛白热化伴随着今年上半年DeepSeek应用推开，尤其是AI算力适配DeepSeek后，全球算力底座正在发生变化。DeepSeek通过强化学习（RL）和模型蒸馏技术的突破，在低算力环境下实现了卓越性能表现，这一进展不仅拓展了AI模型的应用场景，也为GPU云平台创造了新的市场机遇。面对算力时代，AI算力的重要性不言而喻。而AI算力的核心命脉——AI芯片，已成为全球科技竞逐的焦点。上周，GPU（图形处理器）阵营的AMD（AMD.US）刚发布新系列AI芯片MI350，称新芯片性能优于英伟达（NVDA.US）。而应对挑战，英伟达近期还着力推动“主权AI”在全球多地落地，以带动GPU销售。市场分析机构也最新预计，英伟达的客户还在寻找AI芯片替代方案，给英伟达带来压力。近日，英伟达宣布将在德国建设首个工业AI云，配备1万颗Blackwell 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