安集微电子科技（上海）股份有限公司一种用于大马士革铜互连的电镀液及其电镀工艺专利完成公布（电解或电泳工艺专利快讯）

DoNews2025-07-03

天眼查App显示，2025年7月1日，“一种用于大马士革铜互连的电镀液及其电镀工艺”正式进入专利的公布阶段。申请人为安集微电子科技（上海）股份有限公司，该项电解或电泳工艺专利涉及半导体晶圆制造领域中的先进节点铜互连电镀技术。据专利信息显示，采用本发明的电镀铜镀液能够在先进节点实现无空洞、结构致密、表面粗糙度小、平整的效果，具有良好的应用前景。发明人为陈艳、孟迪、彭洪修。本发明提供的电镀液包含硫酸铜...

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