新思科技联合是德科技推出AI驱动的射频设计迁移流程

市场资讯2025-06-27

炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！新思科技与是德科技宣布联合推出人工智能（AI）驱动的射频设计迁移流程，旨在加速从台积公司N6RF+向N4P工艺的迁移，以满足当今要求严苛的无线集成电路应用对性能的需求。全新的射频设计迁移工作流程以台积公司的模拟设计迁移（ADM）方法学为基础，集成了新思科技AI驱动的射频迁移解决方案与是德科技的射频解决方案，可简化无源器件和...

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process","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"SNPS":1},"content_text":"炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 新思科技与是德科技宣布联合推出人工智能（AI）驱动的射频设计迁移流程，旨在加速从台积公司N6RF+向N4P工艺的迁移，以满足当今要求严苛的无线集成电路应用对性能的需求。全新的射频设计迁移工作流程以台积公司的模拟设计迁移（ADM）方法学为基础，集成了新思科技AI驱动的射频迁移解决方案与是德科技的射频解决方案，可简化无源器件和设计组件的重新设计工作，使其符合台积公司更先进的射频工艺规则。新思科技战略与产品管理高级副总裁Sanjay Bali表示，模拟设计迁移一直以来都是一项充满挑战且耗时的工作，需要反复调试与试错。我们与是德科技和台积公司的深度合作，使设计团队能够通过AI驱动的射频设计迁移流程来提高效率，从而加速重新设计流程，更高效地交付射频设计，同时确保在台积公司的先进节点上实现最佳功耗、性能和面积（PPA）。是德科技设计工程软件高级副总裁Niels Faché表示，在满足PPA要求同时，遵守新的工艺设计规则，是复杂射频芯片设计面临的一大挑战。射频电路开发者希望能够充分利用和复用现有的N6RF+器件和组件知识产权库，以提高投入产出比。台积公司ADM方法学融合了新思科技ASO.ai和是德科技 RFPro，前者有助于高效模拟设计迁移，而后者可实现无源器件建模，二者强强联合，可加速重新设计基于N6RF+的现有组件，以便迁移至台积公司先进的N4P技术。整个过程无需耗时的数据交接或领域专用化，这显著提升了射频电路开发者的整体开发效率。台积公司先进技术业务开发处资深处长袁立本表示，我们提供了先进逻辑和混合信号/射频（MS/RF）技术的强大组合，让客户能够设计差异化的无线连接产品。通过与新思科技和是德科技等开放创新平台（OIP）设计生态系统合作伙伴的合作，我们很高兴能够提供高效的射频设计迁移流程，帮助客户快速将其设计迁移到更先进的工艺，充分发挥高性能和能效优势，同时加快上市时间。现在，射频电路开发者可以结合台积公司ADM方法学，运用人工智能技术进行射频设计迁移。除了ADM所带来的效率提升之外，新思科技和是德科技的迁移工作流程还充分利用N4P工艺的性能提升优势，实现了从N6RF+迁移的LNA设计。设计迁移流程的关键组成部分包括：用于快速实现模拟和射频设计迁移的新思科技Custom Compiler™版图环境以及新思科技ASO.ai™，新思科技PrimeSim™电路仿真器，以及用于器件参数化、自动化数值拟合和电磁（EM）仿真的是德科技RFPro。AI为射频电路开发者提供了一种创新方式，使其能够快速完成向N4P工艺的迁移和重新设计，从而显著缩短产品上市时间。新思科技Custom 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