苏州博枫智能申请半导体基板激光切割固定治具专利，能根据半导体基板侧边角度及安装槽内壁倾斜角度调节夹板倾斜角度进行固定

金融界2025-06-14

金融界2025年6月14日消息，国家知识产权局信息显示，苏州博枫智能科技有限公司申请一项名为“一种半导体基板激光切割固定治具”的专利，公开号CN120133713A，申请日期为2025年03月。专利摘要显示，本发明公开了一种半导体基板激光切割固定治具，本发明涉及基板激光切割技术领域，包括固定壳，所述固定壳的一端侧壁固定连接有第一电机，所述固定壳的内壁转动连接有固定框，所述第一电机的输出端贯穿固定壳...

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