6英寸晶圆厂，拟被抛售

天天IC2025-06-16

集微网·爱集微APP，各大主流应用商店均可下载近年来，随着中国大陆厂商在第三代半导体碳化硅（SiC）领域的快速突破，全球SiC市场格局正悄然重塑。特别是在2023年，中国大陆率先打破产出瓶颈，不仅显著提升供货稳定性，也拉低了整体成本，进一步推动SiC产品走向规模化、商业化。与此同时，一些在技术或成本上缺乏竞争力的厂商，逐渐被边缘化，面临“断舍离”的抉择。近日产业链消息指出，一家欧洲一级汽车零部件...

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