突破AI与HPC散热瓶颈：贺利氏下一代TIM1导热膏重磅发布

市场资讯06-13

炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！在设备持续高集成，高算力，高功耗，性能不断突破的今天，散热管理面临着前所未有的挑战，特别是在高性能计算（HPC）和人工智能（AI）等前沿领域。随着热负荷的持续攀升和封装要求的日益严苛，高性能导热界面材料（TIM）已从可选配件转变为不可或缺的关键组件。为此，贺利氏电子推出创新研发的TIM1导热膏，凭借卓越的导热性能、简化的加工...

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