小米发布会解读：超高性能自研“玄戒O1”正式发布高端化新起点

中泰证券股份有...05-23

5月22日小米举行15周年战略新品发布会，新一代自研SoC玄戒O1重磅发布，台积电3nm N3E制程，CPU&GPU性能突出。制程工艺：采用台积电3nm N3E工艺；190亿超大规模晶体管。CPU：“2+4+2+2”的10核四丛集CPU，其中包括2颗3.9GHz超大核（ARM最新一代X925）、4颗主频3.4GHz性能大核、2颗1.9GHz能效大核、2颗1.8GHz超级能效核，整机CPU性能进入...

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v8指令集，由于澎湃S1制程较骁龙625等主流中端SoC落后（骁龙625采用14nm工艺），因此在功耗和发热等方面相对逊色，与当时主流旗舰芯片骁龙820存在较大性能差距，竞争力不强，首发搭载的小米5C机型出货量不高，全年国内出货274万台，占小米手机国内销量5%，全生命周期出货275万台策略转变：2017年后小米芯片自研重点由SoC转向其他手机小芯片，在2021-2024年陆续推出自研ISP、充电、电池管理、信号增强芯片。坚定投入大芯片研发：2021年小米决定重启SoC大芯片业务，与造车项目同时推进。玄戒项目自此立项，并制定了“十年500亿”的长期研发计划。雷军表示“截至 2025年4月底，玄戒累计研发投入已超过135 亿元，团队规模达到2500人，今年预计研发投入将超过 60亿元，在国内芯片设计领域的体量排名前三”。采用3nm制程的玄戒O1芯片于5月22日正式发布。投资建议：重点关注【小米集团-W】，同时建议关注国产SoC供应商【翱捷科技】。风险提示：行业竞争加剧，需求不及预期，新品发布不及预期。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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小米发布会解读：超高性能自研“玄戒O1”正式发布 高端化新起点

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小米发布会解读：超高性能自研“玄戒O1”正式发布高端化新起点