中石科技：产品目前暂未直接应用到芯片封装前的散热 格隆汇 · 52分钟前
格隆汇
2025-05-20
格隆汇5月20日丨中石科技(300684.SZ)在互动平台表示，公司产品目前暂未直接应用到芯片封装前的散热，公司高导热垫片、导热凝胶等产品广泛应用于消费电子元器件中解决导热散热问题。
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