FIT以高效能互连解决方案推进博通CPO计划

讯石光通讯05-15

-导读-FIT鸿腾宣布支持博通CPO)计划，为博通Tomahawk 5 (TH5) Bailly 平台提供关键硬体元件，包括先进的无焊接LGA-to-LGA插座、远端可插拔激光源I/O外壳以及专用的连接器组件。ICC讯5月12日，鸿腾精密科技 (Foxconn Interconnect Technology, FIT)，作为全球精密互连解决方案的领导者，欣然宣布其持续支持博通 (Broadcom)...

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Solutions","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AVGO":1,"FIT":1},"content_text":"-导读-FIT鸿腾宣布支持博通CPO)计划，为博通Tomahawk 5 (TH5) Bailly 平台提供关键硬体元件，包括先进的无焊接LGA-to-LGA插座、远端可插拔激光源I/O外壳以及专用的连接器组件。ICC讯5月12日，鸿腾精密科技 (Foxconn Interconnect Technology, FIT)，作为全球精密互连解决方案的领导者，欣然宣布其持续支持博通 (Broadcom) 的共封装光学 (CPO) 计划。FIT目前正在提供博通 Tomahawk 5 (TH5) Bailly 平台成功所需的关键硬体元件，包括先进的无焊接 LGA-to-LGA 插座、远端可插拔激光源 (以下简称PLS) I/O 外壳，以及专用的连接器组件。这些关键 CPO 元件已进入全面量产阶段，专为新一代数据中心光学架构所需的高效能、可扩展性与整合需求而设计。FIT 所提供的解决方案设计优异，不仅有助于系统无缝系统整合与更能简化组装流程，亦确保长期维护的便利性。先进资料中心网路的精密互连解决方案FIT 的高效能、无焊接 LGA 对 LGA 插槽为整合博通交换 ASIC 至高密度的复杂系统提供简化且稳固的设计方案。该创新设计无需传统焊接程序，使组装更快速、更具弹性，同时确保稳定的良率与可靠性。此类无焊接连接也有助于光学网路不断演进过程中，确保数据中心部署的稳定性与可扩展性。此外，FIT 所设计的 PLS I/O 外壳与连接器组件专为应对高速光学环境下的热管理与机械挑战而打造，对于博通推动激光分离式交换架构的愿景扮演关键角色。这些元件有助于大规模数据中心在电力效率、频宽密度与效能扩展方面取得显着提升。博通：CPO 创新的可信伙伴“我们很荣幸能与FIT合作，共同推动 TH5-Bailly CPO 平台的发展，”博通光学系统事业部硅光子工程总监 Alvin Low 表示。“FIT 在精密互连与系统整合方面的专业能力，对于 CPO 技术在超大规模数据中心环境中实现扩展扮演重要角色。他们的创新元件是推进数据中心光学网路演进的核心。”展望未来：共同开发下一代 CPO 平台FIT 的角色不仅止于目前阶段，未来亦将参与开发下一代单通道 200 Gbps 的 CPO 平台元件。FIT 凭藉其在插槽设计、光学 I/O 及机构系统方面的深厚专业，与博通共同致力于因应 AI 与高效能运算（HPC）工作负载快速增长的挑战。“我们很期待与博通扩大合作，共同推动下一代 200G CPO 解决方案的发展，”FIT业务发展资深总监 Alex An 表示。“双方将致力于打造具备可靠性、能源效率与前瞻设计的尖端互连解决方案，支撑可扩展的 AI 基础设施。”于 2025 年 Computex 展示 CPO 技术未来蓝图作为持续合作的一部分，FIT 将于 2025 年 Computex 展示 LGA 插槽与 I/O 模组的样品，为具资格的平台开发者提供参考，协助打造下一代 AI 驱动的数据中心基础架构。高速光模块与CPO深度布局FIT在高速光模块和CPO布局战略上进行了深度布局。2024年，FIT以人民币2.2亿收购山东华云光电70%的股权，此次收购将进一步加速FIT在高速光模块与CPO技术上市场的布局，以应对AI需求激增带来的光通讯市场。华云光电具备大规模量产100G至800G光模块的技术能力，核心员工均来自顶尖光通信企业，研发和工程人员占总员工数量的30%以上。在华云光电的加入下，FIT光产品的开发进度将大幅提前，例如2025年底前完成1.6T SR8 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