快克智能装备股份有限公司芯片烧结用自锁式工装及芯片翻转装置专利公布（工程元件专利快讯）

iDoNews2025-05-09

天眼查App显示，2025年5月9日，“一种芯片烧结用自锁式工装及芯片翻转装置”正式进入专利的公布阶段。申请人为快克智能装备股份有限公司，该项工程元件专利涉及芯片烧结技术领域，主要用于提升芯片烧结过程中工装的拆装效率。据专利信息显示，该技术可显著优化工装锁定和解锁的操作流程，大幅提高工作效率。发明人为胡小光、高超、顾杰。 “本发明公开一种芯片烧结用自锁式工装，通过移动保持套，便可使钢珠于锁定状态和...

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2534487082?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2025-05-09 21:25","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2534487082","market":"sh","top_or_hot":-1,"title":"快克智能装备股份有限公司芯片烧结用自锁式工装及芯片翻转装置专利公布（工程元件专利快讯）","media":"iDoNews","content":"<div>\n<p>天眼查App显示，2025年5月9日，“一种芯片烧结用自锁式工装及芯片翻转装置”正式进入专利的公布阶段。申请人为快克智能装备股份有限公司，该项工程元件专利涉及芯片烧结技术领域，主要用于提升芯片烧结过程中工装的拆装效率。据专利信息显示，该技术可显著优化工装锁定和解锁的操作流程，大幅提高工作效率。发明人为胡小光、高超、顾杰。 “本发明公开一种芯片烧结用自锁式工装，通过移动保持套，便可使钢珠于锁定状态和...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025050921272497548d1a&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>快克智能装备股份有限公司芯片烧结用自锁式工装及芯片翻转装置专利公布（工程元件专利快讯）</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n快克智能装备股份有限公司芯片烧结用自锁式工装及芯片翻转装置专利公布（工程元件专利快讯）\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-05-09 21:25 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025050921272497548d1a&s=b><strong>iDoNews</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>天眼查App显示，2025年5月9日，“一种芯片烧结用自锁式工装及芯片翻转装置”正式进入专利的公布阶段。申请人为快克智能装备股份有限公司，该项工程元件专利涉及芯片烧结技术领域，主要用于提升芯片烧结过程中工装的拆装效率。据专利信息显示，该技术可显著优化工装锁定和解锁的操作流程，大幅提高工作效率。发明人为胡小光、高超、顾杰。 “本发明公开一种芯片烧结用自锁式工装，通过移动保持套，便可使钢珠于锁定状态和...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025050921272497548d1a&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK0061","symbol_name":"机器人","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025050921272497548d1a&s=b","article_id":"2534487082","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025050921272497548d1a&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2534487082","pubTimestamp":1746797102,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"天眼查App显示，2025年5月9日，“一种芯片烧结用自锁式工装及芯片翻转装置”正式进入专利的公布阶段。申请人为快克智能装备股份有限公司，该项工程元件专利涉及芯片烧结技术领域，主要用于提升芯片烧结过程中工装的拆装效率。据专利信息显示，该技术可显著优化工装锁定和解锁的操作流程，大幅提高工作效率。发明人为胡小光、高超、顾杰。 “本发明公开一种芯片烧结用自锁式工装，通过移动保持套，便可使钢珠于锁定状态和解锁状态之间切换，从而实现压板与底板之间的高效拆装。此外，本发明还公开了一种带有该芯片烧结用自锁式工装的芯片翻转装置。”免责声明：本文内容由开放的智能模型自动生成，仅供参考。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"159813":"芯片","603203":"快克智能","BK0061":"机器人","BK0186":"小盘成长","BK0251":"专用设备"},"translate_title":"Quick Intelligent Equipment Co., Ltd. announced the patent of self-locking tooling and chip turning device for chip sintering (engineering component patent news)","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"159813":1,"603203":1},"content_text":"天眼查App显示，2025年5月9日，“一种芯片烧结用自锁式工装及芯片翻转装置”正式进入专利的公布阶段。申请人为快克智能装备股份有限公司，该项工程元件专利涉及芯片烧结技术领域，主要用于提升芯片烧结过程中工装的拆装效率。据专利信息显示，该技术可显著优化工装锁定和解锁的操作流程，大幅提高工作效率。发明人为胡小光、高超、顾杰。 “本发明公开一种芯片烧结用自锁式工装，通过移动保持套，便可使钢珠于锁定状态和解锁状态之间切换，从而实现压板与底板之间的高效拆装。此外，本发明还公开了一种带有该芯片烧结用自锁式工装的芯片翻转装置。”免责声明：本文内容由开放的智能模型自动生成，仅供参考。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.36.2","shortVersion":"4.36.2","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2534487082","isCrawlerRequest":true}