深南电路：公司FC-BGA封装基板现已具备20层及以下产品批量生产能力

证券之星2025-05-07

证券之星消息，深南电路(002916)05月07日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘你好，请问贵公司的20层FC-BGA先进封装样品在某国内客户处认证进度如何？认证流程大概需要多久完成，能给一个预期时间吗？

深南电路回复：尊敬的投资者，您好。公司FC-BGA封装基板现已具备20层及以下产品批量生产能力，20层产品目前在客户端认证环节已取得比较良好的结果。FC-BGA封装基板的认证周期相较其他PCB及封装基板产品所需时间更长。谢谢您的关注。

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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