晶晨半导体（上海）股份有限公司等“半导体器件和电子设备”专利公布（电子元件专利快讯）

iDoNews2025-05-06

天眼查App显示，2025年5月6日，“半导体器件和电子设备”正式进入专利公布阶段。申请人为晶晨半导体（上海）股份有限公司，该项基本电气元件专利涉及半导体器件及电子设备领域。据专利信息显示，该技术能够显著优化芯片翘曲问题，从而避免因热胀冷缩的应力导致芯片焊接短路和虚焊的问题。发明人为邓海东、陈怡昆、孙顺清。本发明公开了一种半导体器件和电子设备，通过在塑封件下方设置防翘曲件，产生与塑封件形变应力相反...

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