隆扬电子：公司产品PI载体可剥铜可应用于IC载板

证券之星2025-04-30

证券之星消息，隆扬电子(301389)04月29日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问公司的复合铜箔产品可以应用于IC载板吗？是BT载板还是ABF载板？谢谢

隆扬电子回复：尊敬的投资者您好，公司产品PI载体可剥铜可应用于IC载板。感谢您对公司的关注！

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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