光华科技：公司有申请该技术专利

证券之星2025-04-30

证券之星消息，光华科技(002741)04月29日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘，你好。据之前的公告了解：贵公司在半导体电镀技术方面，实现突破。目前晶圆级无氰镀金技术已量产，提升国产替代预期。请问：晶圆级无氰镀金技术，贵公司是否有申请专利？谢谢！

光华科技回复：您好：公司有申请该技术专利。感谢您的关注！

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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