下一代光刻机，台积电观望

半导体行业观察2025-04-29

在半导体新元素的采用方面，台积电多年来一直是先驱，并经常引领潮流。但现在，该公司似乎将放弃在其 A14 工艺中使用高数值孔径 EUV 光刻设备，而是采用更传统的 0.33 数值孔径 EUV 技术。这一消息是在数值孔径技术研讨会上透露的，台积电高级副总裁Kevin Zhang在会上宣布了这一进展。由此可以肯定地说，英特尔代工厂和几家 DRAM 制造商现在在“技术”上比台积电更具优势。Kevin 表示...

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2531287342?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2025-04-29 09:43","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2531287342","market":"sh","top_or_hot":-1,"title":"下一代光刻机，台积电观望","media":"半导体行业观察","content":"<div>\n<p>在半导体新元素的采用方面，台积电多年来一直是先驱，并经常引领潮流。但现在，该公司似乎将放弃在其 A14 工艺中使用高数值孔径 EUV 光刻设备，而是采用更传统的 0.33 数值孔径 EUV 技术。这一消息是在数值孔径技术研讨会上透露的，台积电高级副总裁Kevin Zhang在会上宣布了这一进展。由此可以肯定地说，英特尔代工厂和几家 DRAM 制造商现在在“技术”上比台积电更具优势。Kevin 表示...</p>\n\n<a href=\"https://tech.ifeng.com/c/8iwUxs2yBaE\">网页链接</a>\n\n</div>\n","source":"fenghuang_stock","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>下一代光刻机，台积电观望</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n下一代光刻机，台积电观望\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-04-29 09:43 北京时间&nbsp;&nbsp;&nbsp;<a href=https://tech.ifeng.com/c/8iwUxs2yBaE><strong>半导体行业观察</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>在半导体新元素的采用方面，台积电多年来一直是先驱，并经常引领潮流。但现在，该公司似乎将放弃在其 A14 工艺中使用高数值孔径 EUV 光刻设备，而是采用更传统的 0.33 数值孔径 EUV 技术。这一消息是在数值孔径技术研讨会上透露的，台积电高级副总裁Kevin Zhang在会上宣布了这一进展。由此可以肯定地说，英特尔代工厂和几家 DRAM 制造商现在在“技术”上比台积电更具优势。Kevin 表示...</p>\n\n<a href=\"https://tech.ifeng.com/c/8iwUxs2yBaE\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK4526","symbol_name":"热门中概股","start_time":0,"source_url":"https://tech.ifeng.com/c/8iwUxs2yBaE","article_id":"2531287342","we_media_id":null,"thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2531287342","pubTimestamp":1745890989,"columns":[],"sourceInfo":{"source_id":"fenghuang_stock","name":"凤凰网"},"weMediaInfo":null,"summary":"在半导体新元素的采用方面，台积电多年来一直是先驱，并经常引领潮流。这一消息是在数值孔径技术研讨会上透露的，台积电高级副总裁Kevin Zhang在会上宣布了这一进展。Kevin 表示，台积电将不会使用High NA EUV光刻技术来对A14芯片进行图案化，该芯片的生产计划于2028年开始。High NA推高成本的另一个原因是，台积电的A14芯片单层设计需要多个光罩，而使用最新的光刻工具只会抬高成本，却得不到太多好处。","collect":0,"end_time":0,"defaultTopTitle":"ifeng.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"BK4526":"热门中概股","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","LU0878004406.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) INC","BK4503":"景林资产持仓","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","LU1989772923.USD":"CPR Invest - Climate Action A2 Acc USD-H","TSM":"台积电","BK4527":"明星科技股","LU0348723411.USD":"ALLIANZ GLOBAL HI-TECH GROWTH \"A\" (USD) INC","LU2023250504.SGD":"Allianz Thematica Cl AMg DIS H2-SGD","LU0158827781.USD":" ALLIANZ GLOBAL SUSTAINABILITY \"AT\" (USD) ACC","LU2237443978.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc SGD-H","LU2491049909.HKD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (HKD) ACC","03145":"华夏亚洲高息股","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","LU2089283258.USD":"安联环球可持续基金Cl AM Dis","LU0316494557.USD":"FRANKLIN GLOBAL FUNDAMENTAL STRATEGIES \"A\" ACC","LU2506951792.HKD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (HKDHDG)       ACC","IE0004091025.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"B\" (USD) ACC","SGXZ99366536.SGD":"United Global Innovation A Acc SGD-H","BK4612":"AI芯片","LU0823414478.USD":"法巴经典能源转换基金","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","BK4588":"碎股","BK4550":"红杉资本持仓","LU2125154778.USD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (USD) INC","LU0823414551.USD":"BNP PARIBAS ENERGY TRANSITION \"C\" (USD) INC","BK4605":"半导体精选","IE00BQXX3D17.EUR":"GUINNESS GLOBAL INNOVATORS \"C\" (EUR) ACC","LU0572940350.SGD":"Janus Henderson Horizon Asian Dividend Income A3 SGD","SGXZ51526630.SGD":"大华环球创新基金A Acc SGD","LU2089284900.SGD":"Allianz Global Sustainability Cl AM Dis H2-SGD","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","BK4505":"高瓴资本持仓","LU2663582299.SGD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOL \"A2\" (SGDHDG) ACC","IE00BQXX3F31.USD":"GUINNESS GLOBAL INNOVATORS \"C\" (USD) ACC","LU0109392836.USD":"富兰克林科技股A","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","LU2750360641.GBP":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (GBPHDG) INC","IE00BYQQ9H92.USD":"BNY MELLON GLOBAL LEADERS \"A\" (USD) ACC","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU1508157978.USD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOLUTE RETURN \"A\" (USD) ACC","LU0541502299.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"I\" (USD) ACC","BK4533":"AQR资本管理(全球第二大对冲基金)","LU2211814178.USD":"ALLIANZ CLEAN PLANET \"AT\" (USD) ACC","BK4543":"AI","LU1868838027.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"8\" (USD) ACC","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC"},"translate_title":"The next generation of lithography, TSMC waits and sees","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"TSM":1,"03145":0.6},"content_text":"在半导体新元素的采用方面，台积电多年来一直是先驱，并经常引领潮流。但现在，该公司似乎将放弃在其 A14 工艺中使用高数值孔径 EUV 光刻设备，而是采用更传统的 0.33 数值孔径 EUV 技术。这一消息是在数值孔径技术研讨会上透露的，台积电高级副总裁Kevin Zhang在会上宣布了这一进展。由此可以肯定地说，英特尔代工厂和几家 DRAM 制造商现在在“技术”上比台积电更具优势。Kevin 表示，台积电将不会使用High NA EUV光刻技术来对A14芯片进行图案化，该芯片的生产计划于2028年开始。从2纳米到A14，我们不必使用High NA，但我们可以在处理步骤方面继续保持类似的复杂性。他指出，每一代技术，我们都尽量减少掩模数量的增加。这对于提供经济高效的解决方案至关重要。台积电认为高数值孔径 (NA) 对 A14 工艺无关紧要的主要原因是，使用相关的光刻工具，这家台湾巨头的成本可能会比传统的 EUV 方法高出 2.5 倍，这最终将使 A14 节点的生产成本大大提高，这意味着其在消费产品中的应用将变得困难。这家台湾巨头依赖于芯片设计和产能，但这并不意味着该公司不会在未来的工艺中采用高数值孔径 EUV，因为它计划将其用于 A14P 节点。High NA推高成本的另一个原因是，台积电的A14芯片单层设计需要多个光罩，而使用最新的光刻工具只会抬高成本，却得不到太多好处。相反，通过专注于0.33 NA EUV，台积电可以使用多重曝光技术来保持相同的设计复杂度，而无需High NA EUV的极高精度，最终降低生产成本。有趣的是，台积电放弃HighNA EUV的决定，确实使其在采用最新工具方面落后于英特尔代工厂等公司，因为据说蓝队将在18A工艺中使用High NA，而该工艺预计最早明年就会推出。由于A14P的目标是在2029年推出，台积电在采用High NA方面将比同行至少晚四年，这一决定可能会让竞争对手占据优势。ASML 新增三家High NA EUV 客户ASML 在其最新的收益电话会议上详细介绍了其极紫外 (EUV) 光刻系统，强调随着主要半导体客户采用该系统，High NA 和低 NA 平台都取得了进步。Fouquet 强调了高数值孔径 EUV 技术的增长势头，并指出英特尔已在一个季度内曝光了超过 3 万片晶圆，实现了单层工艺步骤的大幅减少——从 40 步减少到 10 步以下。三星还报告称，在一个用例中，周期时间缩短了 60%。ASML 于第一季度交付了其第五台也是最后一台 EXE:5000 高数值孔径系统，并将于第二季度开始交付后续的 EXE:5200。客户目前正处于以研发为重点的第一阶段应用，预计将于 2026 年至 2027 年间进行试生产（第二阶段），随后在先进节点的关键层上进行量产（第三阶段）。在低数值孔径 (NA) 方面，ASML 的 NXE:3800E 系统现已全面出货，每小时可生产 220 片晶圆，比上一代 NXE:3600 快 30%。现有系统升级正在进行中，并将持续到 2025 年底。Fouquet 表示，设备成熟度现已支持先进逻辑和内存节点的大批量生产，无需担心剩余 NXE:3600 系统的销售问题。Dassen 确认，低数值孔径 EUV 的平均售价 (ASP) 为 2.27 亿欧元（2.588 亿美元），由于产品组合原因略高于预期范围。他建议未来混合平均售价接近 2.2 亿欧元。低数值孔径系统的毛利率仍高于 ASML 的公司平均水平，但具体数字尚未披露。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.43.1","shortVersion":"4.43.1","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2531287342","isCrawlerRequest":true}