联电12nm工艺开发顺利，预计2027年投产

DoNews2025-04-28

联华电子（联电）在本月公布的年度报告中透露，其最先进的12nm工艺节点开发进展顺利。作为与英特尔合作的关键技术，该工艺在功耗、性能和面积（PPA）三大核心指标上较现有14nm工艺有显著提升。客户反馈显示，联电的12nm技术在行业内具备较强竞争力。根据规划，联电将于2026年完成12nm工艺验证，并计划于2027年正式投入生产。此外，在先进封装领域，联电正积极推进晶圆级3D W2W混合键合解决方案，...

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