中石科技：公司高导热垫片等产品广泛应用于消费电子元器件及半导体芯片中解决导热散热问题

互动易2025-03-11

有投资者向中石科技提问，公司官网显示‘热管理方案覆盖芯片级散热’，但年报未披露半导体相关收入。请说明是否已进入头部芯片厂商（如华为海思、平头哥）的供应链？当前供货产品是导热膏、均热板还是定制化模组？公司回答表示，尊敬的投资者您好，公司产品目前暂未直接应用到芯片封装前的散热，公司高导热垫片、导热凝胶等产品广泛应用于消费电子元器件及半导体芯片中解决导热散热问题。感谢您的关注！

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