唯特偶：公司的微电子焊接材料如锡膏、锡线等均可应用到半导体焊接和芯片封装工艺制程中

互动易2025-02-28

有投资者向唯特偶提问，董秘你好公司产品能否应用半导体领域？公司回答表示，尊敬的投资者，您好！公司的微电子焊接材料如锡膏、锡线等均可应用到半导体焊接和芯片封装工艺制程中。感谢您的关注！

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