【德福科技：超高端载体铜箔通过验证将替代进口】金融界1月11日消息，德福科技披露投资者关系活动记录表显示，公司自主研发的超高端载体铜箔已通过某存储芯片龙头公司的验证和工厂制造审核，2025年起将陆续替代进口产品。同时，公司高频通信及高速服务器市场已实现大量国产化替代，高端应用通过深南电路、胜宏科技等PCB厂商验证，并在英伟达项目中实现应用，预计2025年高频高速PCB领域及AI终端应用相关产品出货量将达数千吨级别。

金融界2025-01-11

金融界1月11日消息，德福科技披露投资者关系活动记录表显示，公司自主研发的超高端载体铜箔已通过某存储芯片龙头公司的验证和工厂制造审核，2025年起将陆续替代进口产品。同时，公司高频通信及高速服务器市场已实现大量国产化替代，高端应用通过深南电路、胜宏科技等PCB厂商验证，并在英伟达项目中实现应用，预计2025年高频高速PCB领域及AI终端应用相关产品出货量将达数千吨级别。

网页链接

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

精彩评论

我们需要你的真知灼见来填补这片空白

发表看法

{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2502875037?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2025-01-11 16:06","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2502875037","market":"us","top_or_hot":-1,"title":"【德福科技：超高端载体铜箔通过验证将替代进口】金融界1月11日消息，德福科技披露投资者关系活动记录表显示，公司自主研发的超高端载体铜箔已通过某存储芯片龙头公司的验证和工厂制造审核，2025年起将陆续替代进口产品。同时，公司高频通信及高速服务器市场已实现大量国产化替代，高端应用通过深南电路、胜宏科技等PCB厂商验证，并在英伟达项目中实现应用，预计2025年高频高速PCB领域及AI终端应用相关产品出货量将达数千吨级别。","media":"金融界","content":"<div>\n<p>金融界1月11日消息，德福科技披露投资者关系活动记录表显示，公司自主研发的超高端载体铜箔已通过某存储芯片龙头公司的验证和工厂制造审核，2025年起将陆续替代进口产品。同时，公司高频通信及高速服务器市场已实现大量国产化替代，高端应用通过深南电路、胜宏科技等PCB厂商验证，并在英伟达项目中实现应用，预计2025年高频高速PCB领域及AI终端应用相关产品出货量将达数千吨级别。</p>\n\n<a href=\"https://24h.jrj.com.cn/2025/01/11160647369953.shtml\">网页链接</a>\n\n</div>\n","source":"jinrongjie_stock","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>【德福科技：超高端载体铜箔通过验证将替代进口】金融界1月11日消息，德福科技披露投资者关系活动记录表显示，公司自主研发的超高端载体铜箔已通过某存储芯片龙头公司的验证和工厂制造审核，2025年起将陆续替代进口产品。同时，公司高频通信及高速服务器市场已实现大量国产化替代，高端应用通过深南电路、胜宏科技等PCB厂商验证，并在英伟达项目中实现应用，预计2025年高频高速PCB领域及AI终端应用相关产品出货量将达数千吨级别。</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n【德福科技：超高端载体铜箔通过验证将替代进口】金融界1月11日消息，德福科技披露投资者关系活动记录表显示，公司自主研发的超高端载体铜箔已通过某存储芯片龙头公司的验证和工厂制造审核，2025年起将陆续替代进口产品。同时，公司高频通信及高速服务器市场已实现大量国产化替代，高端应用通过深南电路、胜宏科技等PCB厂商验证，并在英伟达项目中实现应用，预计2025年高频高速PCB领域及AI终端应用相关产品出货量将达数千吨级别。\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-01-11 16:06 北京时间&nbsp;&nbsp;&nbsp;<a href=https://24h.jrj.com.cn/2025/01/11160647369953.shtml><strong>金融界</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>金融界1月11日消息，德福科技披露投资者关系活动记录表显示，公司自主研发的超高端载体铜箔已通过某存储芯片龙头公司的验证和工厂制造审核，2025年起将陆续替代进口产品。同时，公司高频通信及高速服务器市场已实现大量国产化替代，高端应用通过深南电路、胜宏科技等PCB厂商验证，并在英伟达项目中实现应用，预计2025年高频高速PCB领域及AI终端应用相关产品出货量将达数千吨级别。</p>\n\n<a href=\"https://24h.jrj.com.cn/2025/01/11160647369953.shtml\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0106261372.USD","symbol_name":"SCHRODER ISF US LARGE CAP \"A\" ACC","start_time":0,"source_url":"https://24h.jrj.com.cn/2025/01/11160647369953.shtml","article_id":"2502875037","we_media_id":null,"thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2502875037","pubTimestamp":1736582800,"columns":[],"sourceInfo":{"source_id":"jinrongjie_stock","name":"金融界"},"weMediaInfo":null,"summary":"金融界1月11日消息，德福科技披露投资者关系活动记录表显示，公司自主研发的超高端载体铜箔已通过某存储芯片龙头公司的验证和工厂制造审核，2025年起将陆续替代进口产品。同时，公司高频通信及高速服务器市场已实现大量国产化替代，高端应用通过深南电路、胜宏科技等PCB厂商验证，并在英伟达项目中实现应用，预计2025年高频高速PCB领域及AI终端应用相关产品出货量将达数千吨级别。","collect":0,"end_time":0,"defaultTopTitle":"jrj.com.cn","property":[],"viewcount":null,"language":"zh","relate_stocks":{"159665":"芯片龙头","300476":"胜宏科技","301511":"德福科技","LU0106261372.USD":"SCHRODER ISF US LARGE CAP \"A\" ACC","LU1629891620.HKD":"ALLIANZ INCOME AND GROWTH \"AMG2\" (H2-HKD) INC","SGXZ51526630.SGD":"大华环球创新基金A Acc SGD","NVDS":"1.5倍做空NVDA ETF-Tradr","LU0289960550.SGD":"AB FCP I - GLOBAL EQUITY BLEND PORTFOLIO 'A' (SGD) ACC","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","NVIW.SI":"NVDA 3xLongSG261006","LU2125154935.USD":"ALLSPRING (LUX) WF GLOBAL EQUITY ENHANCED INCOME \"I\" (USD) INC","LU0823434583.USD":"BNP PARIBAS US GROWTH \"C\" (USD) ACC","NVDU":"2倍做多NVDA ETF-Direxion","LU2237438978.USD":"Amundi Funds US Pioneer A2 (C) USD","IE0034235188.USD":"PINEBRIDGE GLOBAL FOCUS EQUITY \"A\" (USD) ACC","BK4550":"红杉资本持仓","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","SNVD.UK":"LS -1X NVIDIA","LU0354030511.USD":"ALLSPRING  U.S. LARGE CAP GROWTH \"I\" (USD) ACC","3NVD.UK":"LS 3X NVIDIA","LU1989772840.SGD":"CPR Invest - Climate Action A2 Acc SGD-H","NVD2.UK":"2X NVIDIA ETP","NVDA":"英伟达","NVDX":"2倍做多NVDA ETF-T-Rex","PCB":"PCB Bancorp","LU0345770993.USD":"NINETY ONE GSF GLOBAL STRATEGIC EQUITY \"A\" (USD) INC","LU1989772923.USD":"CPR Invest - Climate Action A2 Acc USD-H","NVD3.UK":"LS 3X NVIDIA","LU0979878070.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"A\" (USD) ACC","NVDY":"NVDA期权收益策略ETF-YieldMax","LU0476273544.USD":"CT (LUX) I GLOBAL TECHNOLOGY \"BU\" (USD) ACC","LU0265550359.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A2\" (USD) ACC","NVD":"2倍做空NVDA ETF-GraniteShares","NVDS.UK":"LS -1X NVIDIA","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","LU0061475181.USD":"THREADNEEDLE (LUX) AMERICAN \"AU\" (USD) ACC","002916":"深南电路","NVDD":"1倍做空NVDA ETF-Direxion","IE0004091025.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"B\" (USD) ACC","LU2491050154.USD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (USD) ACC","LU1861220033.SGD":"Blackrock Next Generation Technology A2 SGD-H","LU2756315664.SGD":"ALLIANZ INCOME AND GROWTH \"AMI\" (SGDHDG) INC","IE00B19Z8W00.USD":"FTGF CLEARBRIDGE US LARGE CAP GROWTH \"A\" INC","LU0069063385.USD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (USD) ACC","2NVD.UK":"2X NVIDIA ETP","HK0000320223.HKD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (HKD) ACC","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","LU2125909916.SGD":"Natixis Thematics Safety R/A SGD","LU2403377893.USD":"ALLIANZ SELECT INCOME AND GROWTH \"AM\" (USD) INC"},"translate_title":"[Telford Technology: Ultra-high-end carrier copper foil will replace imports after verification] According to news from the financial industry on January 11, Telford Technology disclosed an investor relations activity record sheet showing that the company's independently developed ultra-high-end carrier copper foil has passed a certain memory chip The company's verification and factory manufacturing audit will gradually replace imported products from 2025. At the same time, the company's high-frequency communication and high-speed server markets have achieved a large number of domestic substit","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"159665":1,"300476":1,"301511":1,"NVDA":1,"2NVD.UK":0.6,"NVDD":0.6,"NVDX":0.6,"002916":1,"SNVD.UK":0.6,"PCB":1,"3NVD.UK":0.6,"NVDS":0.6,"NVD3.UK":0.6,"NVDY":0.6,"NVD":0.6,"NVDU":0.6,"NVD2.UK":0.6,"NVDS.UK":0.6,"NVIW.SI":0.6},"content_text":"金融界1月11日消息，德福科技披露投资者关系活动记录表显示，公司自主研发的超高端载体铜箔已通过某存储芯片龙头公司的验证和工厂制造审核，2025年起将陆续替代进口产品。同时，公司高频通信及高速服务器市场已实现大量国产化替代，高端应用通过深南电路、胜宏科技等PCB厂商验证，并在英伟达项目中实现应用，预计2025年高频高速PCB领域及AI终端应用相关产品出货量将达数千吨级别。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":false,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"isLaohu8Offline":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.44.1","shortVersion":"4.44.1","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2502875037","isCrawlerRequest":true}