英伟达NVL72机柜价值增量：电源、PCB、BBU、超级电容

市场资讯2025-01-09

一. 英伟达GB300性能据报道，英伟达已初步确定GB300配置情况，主要提升包括：（1）通过新的Ultra架构，带来单卡1.5倍的FP4性能提升；GPU的HBM容量从192GB提升到288GB。（2）B300芯片功率上升到1400W，通过电力调配技术，NVL72机柜能耗保持不变，单位算力能耗降低33%。（3）网络接口卡从CX7提升到CX8，光模块从800G提升到1.6T。（4）电源系统得到升级...

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NVL72机柜价值增量近日，微软发布NVL72实拍：三. 价值增量环节3.1 服务器电源柜内8组PSU，柜外2组PSU+1组BBU，单柜PSU共10组。NVL36：机柜内24+机柜外12，共36个电源；NVL72：机柜内48+机柜外12，共60个电源，服务器电源环节价值量上修。英伟达PCB供应商：HDI板供应商：联能、沪电股份、胜宏科技。当主电源恢复时，BBU将自动充电，以备下次使用。","collect":0,"end_time":0,"defaultTopTitle":"sina.com.cn","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU2420271590.USD":"ALLIANZ SELECT INCOME AND GROWTH \"AT\" (USD) ACC","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","LU0234570918.USD":"高盛全球核心股票组合Acc Close","NVIW.SI":"NVDA 3xLongSG261006","BK4581":"高盛持仓","BK4532":"文艺复兴科技持仓","LU1699723380.USD":"ALLSPRING GLOBAL LONG/SHORT EQUITY \"AP\" (USD) ACC","LU1923622614.USD":"Natixis Thematics Meta R/A USD","LU0820561818.USD":"安联收益及增长平衡基金Cl AM DIS","NVDA":"英伟达","LU0079474960.USD":"联博美国增长基金A","2NVD.UK":"2X NVIDIA ETP","NVDS":"1.5倍做空NVDA ETF-Tradr","IE00BJTD4N35.SGD":"Neuberger Berman US Long Short Equity A1  Acc SGD-H","LU0957791311.USD":"THREADNEEDLE (LUX) GLOBAL FOCUS \"ZU\" (USD) ACC","HK0000320223.HKD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (HKD) ACC","LU1244550494.USD":"FRANKLIN GLOBAL MULTI-ASSET INCOME \"A\" (USDHEDGED) ACC","IE00B7KXQ091.USD":"Janus Henderson Balanced A Inc USD","LU0289739343.SGD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (SGD) ACC","NVDU":"2倍做多NVDA ETF-Direxion","NVD2.UK":"2X NVIDIA ETP","LU0107464264.USD":"abrdn SICAV I - GLOBAL INNOVATION EQUITY \"A\" (USD) ACC","LU1712237335.SGD":"Natixis Mirova Global Sustainable Equity H-R-NPF/A SGD","PCB":"PCB Bancorp","LU1674673691.USD":"HSBC GIF GLOBAL LOWER CARBON EQUITY \"AD\" (USD) INC","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU0096364046.USD":"CT (LUX) I AMERICAN \"DU\" (USD) ACC","LU0943347566.SGD":"安联收益及增长平衡基金AM H2-SGD","NVD3.UK":"LS 3X NVIDIA","LU0267386448.USD":"FIDELITY FIRST ALL COUNTRY WORLD \"A\" (USD) INC","IE00BMPRXQ63.HKD":"NEUBERGER BERMAN NEXT GENERATION CONNECTIVITY FUND \"A\" (HKDHDG) ACC","SNVD.UK":"LS -1X NVIDIA","BK4551":"寇图资本持仓","NVDX":"2倍做多NVDA ETF-T-Rex","3NVD.UK":"LS 3X NVIDIA","LU2092937148.SGD":"Blackrock ESG Multi-Asset A8 SGD-H","NVD":"2倍做空NVDA ETF-GraniteShares","NVDS.UK":"LS -1X NVIDIA","NVDY":"NVDA期权收益策略ETF-YieldMax","LU1244550577.SGD":"FTIF - Franklin Global Multi-Asset Income A (Mdis) SGD-H1","IE00BJTD4V19.USD":"NEUBERGER BERMAN US LONG SHORT EQUITY \"A1\" (USD) ACC","LU0444973449.USD":"CT (LUX) I GLOBAL TECHNOLOGY \"DU\" (USD) ACC","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU0175139822.USD":"AB FCP I Global Equity Blend A USD","NVDD":"1倍做空NVDA ETF-Direxion","LU0345770993.USD":"NINETY ONE GSF GLOBAL STRATEGIC EQUITY \"A\" (USD) INC","BBU":"Brookfield Business Partners","LU0265550359.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A2\" (USD) ACC","LU1720051017.SGD":"Allianz Global Artificial Intelligence AT Acc H2-SGD"},"translate_title":"NVIDIA NVL72 Cabinet Value Increment: Power Supply, PCB, BBU, Supercapacitor","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"NVD2.UK":0.6,"NVDD":0.6,"SNVD.UK":0.6,"NVDY":0.6,"NVDA":1,"BBU":1,"NVD":0.6,"NVIW.SI":0.6,"PCB":1,"2NVD.UK":0.6,"NVDS":0.6,"NVDX":0.6,"NVD3.UK":0.6,"NVDU":0.6,"3NVD.UK":0.6,"NVDS.UK":0.6},"content_text":"一. 英伟达GB300性能据报道，英伟达已初步确定GB300配置情况，主要提升包括：（1）通过新的Ultra架构，带来单卡1.5倍的FP4性能提升；GPU的HBM容量从192GB提升到288GB。（2）B300芯片功率上升到1400W，通过电力调配技术，NVL72机柜能耗保持不变，单位算力能耗降低33%。（3）网络接口卡从CX7提升到CX8，光模块从800G提升到1.6T。 （4）电源系统得到升级，引入超级电容器、备用电池单元BBU。目前在GB200都是选配，到GB300则有望成为标配。二. NVL72机柜价值增量近日，微软发布NVL72实拍：三. 价值增量环节3.1 服务器电源柜内8组PSU，柜外2组PSU+1组BBU，单柜PSU（电源模块）共10组。NVL36：机柜内24+机柜外12，共36个电源；NVL72：机柜内48+机柜外12，共60个电源，服务器电源环节价值量上修。相关供应商：台达、光宝、麦格米特。3.2 PCB引入GPU插槽设计：采用socket方式，替代传统的贴片焊接（SMT），旨在改善计算板良率问题。此举对于PCBA提出了更高的要求，除socket外，还包括高速、高密度钻孔等要求，价值量有望提升。PCBA：在PCB的基础上，将各种电子元器件（如芯片、电容、电感）进行安装、焊接、检测等工艺流程后，形成的完整电路板组件。英伟达PCB供应商：（1）HDI板供应商：联能、沪电股份、胜宏科技。（2）高多层板供应商：景旺电子、方正科技。此外，正交架构方案使用混压PTFE高多层板，上游PTFE材料供应商有望受益：罗杰斯、国能新材、生益科技。景旺电子：高端PCB制造商，产品类型覆盖刚性板、柔性板、HDI；与生益科技合作，突破PTFE材料加工瓶颈，使其应用于22层高多层板。方正科技：在高多层板、HDI领域具有竞争力，与国能新材合作，突破PTFE材料加工瓶颈，使其应用于22层高多层板。3.3 BBUBBU即电池备份单元，是一种用于提供应急电力支持的功能性组件，防止市电故障导致的数据丢失和业务中断。BBU可以在断电时为服务器提供短暂电力，其响应速度在毫秒级，供电时间在5-7分钟，以确保数据备份或系统安全关闭。当主电源恢复时，BBU将自动充电，以备下次使用。BBU供应商以台企为主：台达、顺达、新盛力、AES-KY；上游电芯供应商：蔚蓝锂芯。蔚蓝锂芯：布局BBU电芯，在供BBU电池客户包括AES-KY、顺达、新盛力等，目前向台达、光宝等公司送样。3.4 超级电容器超级电容器是一种新型储能元器件，同时具备电容快速充放电，以及电池的储能特性，主要特性包括功率密度高、循环寿命长、安全性高。超级电容主要包括EDLC（双电层电容器）、LIC(锂离子超容)两类，其中LIC在能量密度、功率密度、高温性能等方面更具优势。超级电容在数据中心的应用：（1）负载平衡：在电力负载急剧变化时提供功率补偿，稳定电压波动，保证了设备在高负载条件下的稳定运行。（2）弥补电力缺口：如果发生断电，超级电容可提供瞬时电力，作为后备电源系统上线前的过渡。市场格局方面，以海外厂商为主，全球前五大厂商包括：Maxwell、松下、日本化学电容器、维纳泰克、山姆华电子。国内厂商包括：江海股份、风华高科；上游供应商包括：新宙邦。江海股份：主营铝电解电容、薄膜电容、超级电容器；收购日本ACT布局超级电容，在LIC、EDLC领域均有市场份额和技术优势。（转自：伏白的交易笔记）\n\n\n海量资讯、精准解读，尽在新浪财经APP","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.36.0","shortVersion":"4.36.0","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2502621090","isCrawlerRequest":true}