传苹果自研Wi-Fi芯片和5G基带芯片将于2025年商用

芯智讯2024-09-20

9月20日消息，据DigiTimes报道称，苹果公司可能将于2025年推出自研的Wi-Fi芯片和5G基带芯片，以减少对于博通公司和高通公司的依赖。但是，这一切仍有可能会延迟。报道称，苹果可能将会在2025年推出的新款iPad机型上率先采用自研的Wi-Fi芯片，而廉价版的iPhone SE 4 则将会配备苹果自研的5G基带芯片。鉴于当前一代 iPad 10 配备的是博通的Wi-Fi 6芯片，因此明年...

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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202409201321189f093bfd&s=b><strong>芯智讯</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>9月20日消息，据DigiTimes报道称，苹果公司可能将于2025年推出自研的Wi-Fi芯片和5G基带芯片，以减少对于博通公司和高通公司的依赖。但是，这一切仍有可能会延迟。报道称，苹果可能将会在2025年推出的新款iPad机型上率先采用自研的Wi-Fi芯片，而廉价版的iPhone SE 4 则将会配备苹果自研的5G基带芯片。鉴于当前一代 iPad 10 配备的是博通的Wi-Fi 6芯片，因此明年...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202409201321189f093bfd&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"IE00B19Z8X17.USD","symbol_name":"FTGF CLEARBRIDGE US LARGE CAP GROWTH  \"AG\" (USD) 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