研报新知|“玻璃基板”概念横空出世，未来或将取代有机材料基板，这家企业相关产品已批量生产

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近日“玻璃基板”概念横空出世，不少个股掀起涨停潮。原因是摩根士丹利曝出英伟达GB200采用的先进封装工艺将使用玻璃基板（全球第一个使用玻璃基板来封装的芯片）。芯片基板材料经历了两次迭代，最开始是利用引线框架固定芯片，到90年代陶瓷基板取代了引线框架，而现在最常见的是有机材料基板。相对于有机材料基板，玻璃基板具有更好的热稳定性和机械稳定性以及超低平坦度。英伟达的技术路径选择很大程度上代表了行业未来...

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