台积电(TSM)首度发布A16新型芯片制造技术，预计2026年量产

金吾财讯04-25

金吾财讯 | 当地时间4月24日，台积电(TSM)在美国加州圣克拉拉举行的北美技术论坛上，发布了一项名为TSMC A16的新型芯片制造技术，预计于2026年量产。据悉，台积电这次首度发布TSMC A16技术，结合领先的纳米片电晶体及创新的背面电轨（backsidepower rail）解决方案以大幅提升逻辑密度及效能，预计于2026年量产。

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2430541935?lang=zh_CN&edition=full","thumbnail":"https://static.szfiu.com/news/20210625/NzQ0MDFhN2VhZDk5MjYwZWE0ZjgxMTYyNDYwMDUxODg2NQ==.jpg","is_english":false,"pubTime":"2024-04-25 08:51","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2430541935","market":"fut","top_or_hot":-1,"title":"台积电(TSM)首度发布A16新型芯片制造技术，预计2026年量产","media":"金吾财讯","content":"<html><body><p>金吾财讯 | 当地时间4月24日，<a href=\"https://laohu8.com/S/TSM\">台积电</a>(TSM)在美国加州圣克拉拉举行的北美技术论坛上，发布了一项名为TSMC A16的新型芯片制造技术，预计于2026年量产。据悉，台积电这次首度发布TSMC A16技术，结合领先的纳米片电晶体及创新的背面电轨（backsidepower rail）解决方案以大幅提升逻辑密度及效能，预计于2026年量产。</p></body></html>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>台积电(TSM)首度发布A16新型芯片制造技术，预计2026年量产</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n台积电(TSM)首度发布A16新型芯片制造技术，预计2026年量产\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-04-25 08:51 北京时间&nbsp;&nbsp;&nbsp;<a href=275231><strong>金吾财讯</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>金吾财讯 | 当地时间4月24日，台积电(TSM)在美国加州圣克拉拉举行的北美技术论坛上，发布了一项名为TSMC A16的新型芯片制造技术，预计于2026年量产。据悉，台积电这次首度发布TSMC A16技术，结合领先的纳米片电晶体及创新的背面电轨（backsidepower rail）解决方案以大幅提升逻辑密度及效能，预计于2026年量产。</p>\n\n<a href=\"275231\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"SG9999000418.SGD","symbol_name":"Aberdeen Standard Global Technology SGD","start_time":0,"source_url":"275231","article_id":"2430541935","we_media_id":"1086022552","thumbnails":["https://static.szfiu.com/news/20210625/NzQ0MDFhN2VhZDk5MjYwZWE0ZjgxMTYyNDYwMDUxODg2NQ==.jpg"],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2430541935","pubTimestamp":1714006305,"sourceInfo":null,"weMediaInfo":{"media_name":"金吾财讯","introduction":"「金吾财讯」以精准用户需求为切入点，打造一站式港美股投资细分领域品牌。依托战略合作伙伴凤凰网财经，将港美股内容传播到全球华人圈。","home_visible":1,"id":"1086022552","head_image":"https://static.tigerbbs.com/19a93586c3b023ec6ebfed568990555c"},"summary":"金吾财讯 | 当地时间4月24日，台积电(TSM)在美国加州圣克拉拉举行的北美技术论坛上，发布了一项名为TSMC A16的新型芯片制造技术，预计于2026年量产。据悉，台积电这次首度发布TSMC A16技术，结合领先的纳米片电晶体及创新的背面电轨（backsidepower rail）解决方案以大幅提升逻辑密度及效能，预计于2026年量产。","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"zh","relate_stocks":{"159813":"芯片","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","LU1267930813.SGD":"FRANKLIN TEMPLETON SHARIAH GLOBAL EQUITY \"AS\" (SGD) ACC","BK4503":"景林资产持仓","TSM":"台积电","SG9999004220.SGD":"Nikko AM Shenton Asia Dividend Equity Fund  SGD","LU0878005551.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) ACC","BK4505":"高瓴资本持仓","BK4588":"碎股","BK4581":"高盛持仓","BK4512":"苹果概念","IE00B3M56506.USD":"NEUBERGER BERMAN EMERGING MARKETS EQUITY \"A\" (USD) ACC","BK4548":"巴美列捷福持仓","LU1211504680.USD":"ALLIANZ HIGH DIVIDEND ASIA PACIFIC EQUITY \"AM\" (USD) INC","BK4591":"室温超导概念","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","03145":"华夏亚洲高息股","LU0348723411.USD":"ALLIANZ GLOBAL HI-TECH GROWTH \"A\" (USD) INC","BK4554":"元宇宙及AR概念","LU0572940350.SGD":"Janus Henderson Horizon Asian Dividend Income A3 SGD","BK4532":"文艺复兴科技持仓","LU0541501648.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"A\" (USD) ACC","LU2491049909.HKD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (HKD) ACC","LU0889566641.SGD":"FTSF - Templeton Shariah Global Equity A Acc SGD","BK4585":"ETF&股票定投概念","LU2491050071.SGD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (SGDHDG) ACC","BK4534":"瑞士信贷持仓","LU0541502299.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"I\" (USD) ACC","BK4550":"红杉资本持仓","LU2491050154.USD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (USD) ACC","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU2237443382.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA USD","BK4533":"AQR资本管理(全球第二大对冲基金)","LU0264606111.USD":"Janus Henderson Horizon Asian Dividend Income A2 USD","LU2360032135.SGD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (SGDHDG) INC","BK4526":"热门中概股","LU2237443549.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA SGD-H","LU1623119135.USD":"Natixis Mirova Global Sustainable Equity R-NPF/A USD","LU2125154935.USD":"ALLSPRING (LUX) WF GLOBAL EQUITY ENHANCED INCOME \"I\" (USD) INC","EWT":"台湾ETF-iShares MSCI","BK4141":"半导体产品","LU2125154778.USD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (USD) INC","LU2237443622.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc USD","LU1712237335.SGD":"Natixis Mirova Global Sustainable Equity H-R-NPF/A SGD","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","BK4527":"明星科技股","LU2237443978.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc SGD-H","LU1989764748.USD":"东方汇理环球颠覆性机遇A2 Acc","LU0572939691.SGD":"Janus Henderson Horizon Asian Dividend Income A2 SGD"},"translate_title":"TSMC (TSM) released the A16 new chip manufacturing technology for the first time, which is expected to be mass-produced in 2026","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"159813":1,"TSM":1,"TWmain":1,"03145":0.6,"EWT":0.6},"content_text":"金吾财讯 | 当地时间4月24日，台积电(TSM)在美国加州圣克拉拉举行的北美技术论坛上，发布了一项名为TSMC A16的新型芯片制造技术，预计于2026年量产。据悉，台积电这次首度发布TSMC A16技术，结合领先的纳米片电晶体及创新的背面电轨（backsidepower rail）解决方案以大幅提升逻辑密度及效能，预计于2026年量产。","kind":null,"is_publish_news":null,"is_publish_highlight":null,"is_publish_live":null,"is_publish_wemedia":null,"editions":null,"symbols":[],"gpt_button":0},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"deviceId":"web-server-community-laohu8-v3","version":"4.22.4","shortVersion":"4.22.4","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2430541935"}