三星与AMD签订供货合同采购HBM3E内存和AI加速卡

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根据韩媒报道，三星和AMD公司签署了一份价值4万亿韩元（约210.8亿元人民币）的供货合同。根据合同，AMD将采购三星的HBM3E内存，而三星也将采购AMD的AI加速卡。具体换购数量目前尚未透露。三星计划今年上半年开始量产HBM3E 12H内存，并预计将在下半年开始量产相关的AI加速卡。与8层堆叠的HBM3 8H相比，HBM3E 12H在带宽和容量上提升了超过50%。这项技术采用了热压非导电薄膜（...

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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202404241456118b4daf53&s=b><strong>中关村在线</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>根据韩媒报道，三星和AMD公司签署了一份价值4万亿韩元（约210.8亿元人民币）的供货合同。根据合同，AMD将采购三星的HBM3E内存，而三星也将采购AMD的AI加速卡。具体换购数量目前尚未透露。三星计划今年上半年开始量产HBM3E 12H内存，并预计将在下半年开始量产相关的AI加速卡。与8层堆叠的HBM3 8H相比，HBM3E 12H在带宽和容量上提升了超过50%。这项技术采用了热压非导电薄膜（...</p>\n\n<a 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card","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AMD":1,"GFS":1},"content_text":"根据韩媒报道，三星和AMD公司签署了一份价值4万亿韩元（约210.8亿元人民币）的供货合同。根据合同，AMD将采购三星的HBM3E内存，而三星也将采购AMD的AI加速卡。具体换购数量目前尚未透露。三星计划今年上半年开始量产HBM3E 12H内存，并预计将在下半年开始量产相关的AI加速卡。与8层堆叠的HBM3 8H相比，HBM3E 12H在带宽和容量上提升了超过50%。这项技术采用了热压非导电薄膜（TC NCF）技术，以解决芯片弯曲问题，并提高更高层叠产品所需的垂直密度。报道还称，三星一直在努力降低其非导电薄膜（NCF）材料的厚度并实现间隙最小化至7微米。这些努力使得HBM3E 12H产品的垂直密度比其HBM3 8产品提高了20%以上。同时，报道指出，由于行业对缓解薄片带来的芯片弯曲问题的关注，这项技术将在更高的堆叠中带来更多益处。综上所述，三星和AMD签署了一笔大额供货合同，涉及到HBM3E内存和AMD的AI加速卡采购。双方都希望通过这次交易获得更多的竞争优势。三星在生产过程中不断改进其非导电薄膜技术和垂直密度，以满足市场对于高密度内存和AI加速卡的需求。本文属于原创文章，如若转载，请注明来源：三星与AMD签订供货合同 采购HBM3E内存和AI加速卡https://ai.zol.com.cn/867/8678344.htmlhttps://ai.zol.com.cn/867/8678344.htmlai.zol.com.cntrue中关村在线https://ai.zol.com.cn/867/8678344.htmlreport874根据韩媒报道，三星和AMD公司签署了一份价值4万亿韩元（约210.8亿元人民币）的供货合同。根据合同，AMD将采购三星的HBM3E内存，而三星也将采购AMD的AI加速卡。具体换购数量目前尚未透露。三星计划今年上半年开始量产HBM3E 12H内存，并预计将在下半年开始量产相关的AI加速...","kind":null,"is_publish_news":null,"is_publish_highlight":null,"is_publish_live":null,"is_publish_wemedia":null,"editions":null,"symbols":[],"gpt_button":1},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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三星与AMD签订供货合同 采购HBM3E内存和AI加速卡

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三星与AMD签订供货合同采购HBM3E内存和AI加速卡