三星与AMD签订价值30亿美元的新协议：将供应12层堆叠的HBM3E

砍柴网04-24

去年10月，三星举办了“Samsung Memory Tech Day 2023”活动，宣布推出代号为“Shinebolt”的新一代HBM3E DRAM。到了今年2月，三星宣布已开发出业界首款HBM3E 12H DRAM，拥有12层堆叠，容量为36GB，是迄今为止带宽和容量最高的HBM产品。随后三星开始向客户提供了样品，计划下半年开始大规模量产。据Viva100报道，三星已经与AMD签订价值30...

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