因缺乏政府资助应用材料(AMAT.US)或放弃投资40亿美元在硅谷建设芯片研究中心

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智通财经APP获悉，据媒体援引知情人士消息报道，美国最大的半导体设备制造商应用材料(AMAT.US)可能将推迟或放弃投资40亿美元在硅谷建设芯片研究中心的计划，原因是缺乏政府资助。美国商务部芯片计划办公室上月底宣布，由于美国《芯片与科学法案》激励资金的需求过大，该办公室决定目前不推进在美国建造、更新或扩建半导体研发设施的资助机会通知(NOFO)。资料显示，美国国会于2022年通过了《芯片与科学法案...

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因缺乏政府资助 应用材料(AMAT.US)或放弃投资40亿美元在硅谷建设芯片研究中心

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因缺乏政府资助应用材料(AMAT.US)或放弃投资40亿美元在硅谷建设芯片研究中心