大模型落地手机芯片！阿里云牵手联发科趟路子，低迷手机市场等风来

华夏时报03-29

AI大模型在手机终端上的部署日益提速。3月28日，阿里云与联发科联合宣布，通义千问18亿、40亿参数大模型已成功部署进天玑9300移动平台。据悉，这是通义大模型首次完成芯片级的软硬适配，同时意味着Model-on-Chip的探索正式从验证走向商业化落地新阶段。在这背后，本身拥有计算能力的终端被认为是AI大模型落地的重要场景之一，特别是使用频率极高的手机。与此同时，外界也期待AI大模型能搅动疲软许久...

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